ASE is a critical link in the semiconductor supply chain. We are proud to have played a significant role and applying our technology on many of the world’s most innovative electronics.
ASE offers customers complete manufacturing capability including system design, software development, module testing and electrical heat transfer simulation technology to enable smaller, higher performance, lower power consumption and more cost effective end products.
Our technologies have also enabled our customers to create cutting edge products that deliver superior performance, power, speed and connectivity.
Automation, heterogeneous integration in machine and production systems, and heterogeneous integration in systems-in-package (SiP) are 3 major forces driving smart factories and digital transformation at ASE.
front-end engineering test, wafer probing, package design, substrate design and manufacturing, packaging & test, module, board assembly & test and distribution are fully integrated onto a single supply chain.
ASE continues to lead the semiconductor industry with its cutting edge IC packaging technologies to meet the requirements of high-performance electronics products.
ASE believe that the sustainable development of our enterprise and the realization of its social responsibilities are vital to our long-term strategies and success.
All around us, digital transformation is changing the way we live, work, play and communicate.
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